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lenovo Thinkssytem SD665 N V3 Super computing SR665 v3 Rack server for Lenovo 1x or 2x 4th AMD EPYC 96 Cores / 400W 24x 128GB TruDDR5

$1,500.00$2,500.00

  1. Form Factor & Density
    • SD665-N V3: 4U multi-node (2 independent nodes) for high-density HPC/AI workloads.
    • SR665 V3: 2U single-node for general-purpose rack deployments.
  2. Processor & Memory
    • Both use AMD EPYC 9004, but the SD665-N V3 maximizes core density per rack unit (2 nodes = 256 cores in 4U).
    • SR665 V3 supports dual sockets in 2U, better for single-system memory-heavy workloads.
  3. GPU & Acceleration
    • SD665-N V3 supports more GPUs (6 vs. 4) and liquid cooling for extreme HPC workloads.
    • SR665 V3 offers better storage flexibility (24-drive bays vs. 16).
  4. Networking
    • SD665-N V3 includes NVIDIA InfiniBand (standard) for low-latency supercomputing.
    • SR665 V3 uses standard 100GbE or optional InfiniBand.
  5. Cooling & Power
    • SD665-N V3 is optimized for liquid-cooled data centers (DLC-ready).
    • SR665 V3 uses air cooling (DLC optional).

Which to Choose?

  • For HPC/AI Clusters: SD665-N V3 (higher GPU density, InfiniBand, liquid cooling).
  • For Enterprise Rack Deployments: SR665 V3 (storage flexibility, dual-socket support).
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lenovo Thinkssytem SD665 N V3 Super computing SR665 v3 Rack server for Lenovo 1x or 2x 4th AMD EPYC 96 Cores / 400W 24x 128GB TruDDR5

Here’s a detailed comparison table between the Lenovo ThinkSystem SD665-N V3 (Supercomputing Server) and ThinkSystem SR665 V3 (Rack Server):


Lenovo ThinkSystem SD665-N V3 vs. SR665 V3 – Comparison Table

Feature ThinkSystem SD665-N V3 (Supercomputing) ThinkSystem SR665 V3 (Rack Server)
Form Factor 4U (Multi-Node, 2 Nodes per Chassis) 2U (Single Node)
Processor 4th Gen AMD EPYC 9004 Series (up to 128 cores per node) 4th Gen AMD EPYC 9004 Series (up to 128 cores)
Max Sockets per Node 1P (Single Socket per Node) 2P (Dual Socket)
Max Cores per System 256 Cores (2 nodes × 128 cores) 256 Cores (2 sockets × 128 cores)
Memory Capacity Up to 6TB DDR5 per Node (12TB total) Up to 6TB DDR5 (24 DIMM slots)
Memory Bandwidth 12-Channel DDR5-4800 per node 12-Channel DDR5-4800
Storage Bays 8 x 2.5″ NVMe/SAS per Node (16 total) Up to 24 x 2.5″ or 12 x 3.5″ (SAS/NVMe)
PCIe Expansion 3 x PCIe 5.0 Slots per Node (6 total) 8 x PCIe 5.0 Slots
GPU Support Up to 6 GPUs (3 per node, e.g., NVIDIA H100) Up to 4 GPUs (e.g., NVIDIA A100)
Networking 200Gb/s NVIDIA Quantum-2 InfiniBand (per node) OCP 3.0 100GbE or 200Gb InfiniBand
Cooling Direct Liquid Cooling (DLC) Support Air Cooling (Optional DLC)
Power Supply 2000W Titanium (N+N Redundant) 2000W Platinum/Titanium
Use Case HPC, AI/ML, Supercomputing Clusters Virtualization, Databases, AI/ML
Key Advantage Density-Optimized for GPU/CPU Scalability Balanced Compute-Storage Expansion

Lenovo ThinkSystem SD665-N V3 Supercomputing Server

The ThinkSystem SD665-N V3 is a high-density, 4U multi-node supercomputing server designed for extreme-scale HPC, AI training, and GPU-accelerated workloads. Each chassis houses two independent server nodes, with each node powered by a 4th Gen AMD EPYC 9004 processor (up to 128 cores) and 6TB DDR5 memory (12TB total per chassis). Optimized for liquid-cooled data centers, it supports up to 6 GPUs (3 per node, including NVIDIA H100/A100) and features NVIDIA Quantum-2 InfiniBand (200Gb/s) for ultra-low-latency interconnects. With 8 x 2.5″ NVMe bays per node (16 total), it delivers massive parallel storage throughput for AI/ML datasets. The SD665-N V3 excels in supercomputing clusters, large-scale simulations, and generative AI, offering unmatched compute density per rack unit.

Key Features:

  • 4U multi-node chassis (2 nodes)
  • 4th Gen AMD EPYC 9004 (128 cores/node, 256 cores/chassis)
  • Up to 12TB DDR5 (6TB/node @ 4800MHz)
  • 6 x PCIe 5.0 slots (3/node) for GPUs/accelerators
  • 16 x 2.5″ NVMe bays (8/node, 1.6M random IOPS)
  • NVIDIA Quantum-2 InfiniBand (200Gb/s per node)
  • Direct Liquid Cooling (DLC) support
  • Ideal for: Exascale HPC, AI training, CFD, climate modeling

Lenovo ThinkSystem SR665 V3 Rack Server

The ThinkSystem SR665 V3 is a versatile 2U dual-socket rack server built for enterprise virtualization, databases, and mixed AI workloads. Featuring dual 4th Gen AMD EPYC 9004 CPUs (up to 256 cores total) and 6TB DDR5 memory, it balances compute power, storage flexibility (24 x 2.5″ or 12 x 3.5″ bays), and PCIe 5.0 expansion (8 slots). It supports up to 4 GPUs (e.g., NVIDIA A100/L40S) and offers 100GbE or InfiniBand networking (OCP 3.0). Unlike the SD665-N V3, the SR665 V3 prioritizes general-purpose workloads with air cooling (optional DLC), making it ideal for private clouds, SAP HANA, and software-defined storage.

Key Features:

  • 2U single-node design
  • Dual 4th Gen AMD EPYC 9004 (256 cores total)
  • Up to 6TB DDR5 (24 DIMMs @ 4800MHz)
  • 8 x PCIe 5.0 slots (supports 4 GPUs)
  • 24 x 2.5″ or 12 x 3.5″ bays (NVMe/SAS/SATA)
  • OCP 3.0 (100GbE/200Gb InfiniBand)
  • Air-cooled (DLC optional)
  • Ideal for: Cloud-native apps, SQL/NoSQL databases, mid-range AI

Comparison Summary

Aspect SD665-N V3 SR665 V3
Design Goal Supercomputing density Enterprise rack versatility
Node Density 2 nodes/4U (256 cores total) 1 node/2U (256 cores)
GPU Support 6 GPUs (3/node, liquid-cooled) 4 GPUs (air/DLC)
Storage 16 x NVMe (8/node) 24 x 2.5″ or 12 x 3.5″ (hybrid)
Networking NVIDIA InfiniBand (standard) OCP 3.0 (Ethernet/InfiniBand optional)
Cooling Liquid-cooled (DLC standard) Air-cooled (DLC optional)

Choose SD665-N V3 if: You need maximum GPU/core density for HPC/AI clusters.
Choose SR665 V3 if: You need storage flexibility for enterprise or hybrid cloud workloads.

Thinkssytem SD665 N V3

SR665 v3 Rack, Thinkssytem SD665 N V3

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