Purpose-built Edge Compute Server Lenovo Thinksystem SE350 Edge server ThinkEdge SE 350 V2 in Tel Xeon D-2100 Processor

Purpose-built Edge Compute Server Lenovo Thinksystem SE350 Edge server ThinkEdge SE 350 V2 in Tel Xeon D-2100 Processor

Here’s a detailed comparison table between the Lenovo ThinkSystem SE350 Edge Server and ThinkEdge SE350 V2:

Lenovo ThinkEdge SE350 vs SE350 V2 Comparison Table

Feature	ThinkEdge SE350 (1st Gen)	ThinkEdge SE350 V2 (2nd Gen)	Difference
Form Factor	1U Short Depth (430mm)	1U Short Depth (430mm)	Same
Processor	Intel Xeon D-2100	Intel Xeon D-2700	Newer generation (30%+ perf boost)
Max Cores	Up to 16 cores	Up to 20 cores	+4 cores
Memory	Up to 256GB DDR4	Up to 512GB DDR4	2x capacity
Storage	2 x 2.5″ bays	4 x 2.5″ bays	2x expansion
PCIe Expansion	1 x PCIe 3.0 x16	1 x PCIe 4.0 x16	Faster interface
GPU Support	None (CPU-only)	Optional Intel Arc GPU	New GPU option
Networking	4 x 1GbE	4 x 1GbE + 2 x 10GbE SFP+	10GbE added
Power	250W PSU	300W PSU	Higher wattage
Edge Features	-40°C to 65°C operation	-40°C to 70°C operation	Wider temp range
Security	TPM 2.0	TPM 2.0 + SGX	Added SGX
Management	XClarity Controller	XClarity Enhanced Controller	Improved
Weight	9.5kg	8.7kg	Lighter

Lenovo ThinkSystem SE350 Edge Server

The ThinkSystem SE350 is a compact 1U short-depth (430mm) edge server designed for space-constrained environments like telecom closets, factory floors, and remote offices. Powered by Intel Xeon D-2100 processors (up to 16 cores), it delivers enterprise-grade compute in a ruggedized package capable of operating in extreme temperatures (-40°C to 65°C). With 256GB DDR4 memory, dual 2.5″ drive bays, and 4x 1GbE ports, it handles lightweight edge workloads such as IoT aggregation, network virtualization (NFVi), and distributed storage. The SE350 lacks GPU support but includes TPM 2.0 security and Lenovo’s XClarity management for remote monitoring.

Key Features:

• 1U short-depth (430mm) for tight spaces
• Intel Xeon D-2100 (up to 16 cores, 85W TDP)
• Up to 256GB DDR4 ECC memory
• 2 x 2.5″ hot-swap bays (SATA/NVMe)
• 4 x 1GbE ports + 1 x PCIe 3.0 x16 (expansion)
• Ruggedized: -40°C to 65°C operation, 9.5kg weight
• Ideal for: Industrial IoT, branch office virtualization, lightweight edge analytics

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Lenovo ThinkEdge SE350 V2 Edge Server

The ThinkEdge SE350 V2 is a next-generation edge server that upgrades the SE350 with 2x the performance, storage, and memory capacity. Featuring Intel Xeon D-2700 processors (up to 20 cores) and PCIe 4.0 support, it tackles AI inference, 5G MEC, and real-time analytics at the edge. The V2 doubles memory (512GB DDR4), adds two 10GbE SFP+ ports, and supports 4 x 2.5″ drives—making it ideal for data-intensive edge workloads. New ruggedization extends its operating range to -40°C to 70°C, while Intel SGX and an optional Intel Arc GPU enable secure, accelerated edge AI.

Key Features:

• 1U short-depth (430mm) with improved airflow
• Intel Xeon D-2700 (up to 20 cores, 30% faster than V1)
• Up to 512GB DDR4 (2x V1 capacity)
• 4 x 2.5″ hot-swap bays (NVMe/SATA) + PCIe 4.0 x16
• 4 x 1GbE + 2 x 10GbE SFP+ (for 5G/edge networking)
• Optional Intel Arc GPU (AI inference acceleration)
• Enhanced ruggedization: -40°C to 70°C, 8.7kg (lighter)
• Ideal for: Edge AI, 5G MEC, real-time video analytics, smart factories

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Comparison Summary

Aspect	SE350 (V1)	SE350 V2
Processor	Xeon D-2100 (16 cores)	Xeon D-2700 (20 cores, PCIe 4.0)
Memory	256GB DDR4	512GB DDR4
Storage	2 x 2.5″ bays	4 x 2.5″ bays
Networking	4 x 1GbE	4 x 1GbE + 2 x 10GbE SFP+
GPU Support	None	Optional Intel Arc GPU
Rugged Range	-40°C to 65°C	-40°C to 70°C
Security	TPM 2.0	TPM 2.0 + Intel SGX

Upgrade Recommendation:

• For legacy edge workloads: The SE350 V1 remains cost-effective for basic IoT/NFVi.
• For AI/5G edge deployments: The SE350 V2 delivers 2x performance, 10GbE, and GPU acceleration, future-proofing edge infrastructure.